【2025 Campus Recruitment】Research and Development Engineer (R&D)

台灣積體電路製造股份有限公司(台積電) ‧260個職缺
  • 全職

面議(經常性薪資達4萬元或以上)

  • 碩士

  • 博士

新竹縣 寶山鄉

  • 需求人數

    不限

  • 到職日期

    不限

  • 更新日期

工作內容

職缺描述

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15376&source=1111&tags=domestic+campus+2025_1111 Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

收合內容

工作待遇

面議 (經常性薪資達4萬元或以上)

查看薪資水平

職務類別

  • 半導體工程師

工作性質

  • 全職

工作時間

  • 日班

休假制度

  • 週休二日

工作地點

新竹縣寶山鄉 (新竹科學園區)

要求條件

學歷要求

  • 碩士

  • 博士

工作經驗

不拘

外語能力

  • 英文 聽| 精通、 説| 精通、 讀| 精通、 寫| 精通

工作技能

不拘

附加條件

1. Passionate about the development of world-leading technologies. 2. Master‘s degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics. 4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners. 5. Fluent in English. 6. Skills in AI and programming are preferred. 7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage. 8. Flexibility in changing priorities and responsibilities to support business needs. 9. Hands-on participation on process or hardware and a strong sense of ownership. 10. Willing to make frequent fab presence. 11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required. 12. Excellent written and spoken communication skills are required.

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公司資訊

品牌名稱

產業類別

  • 半導體製造

聯絡資訊

聯絡人員

招募處

備註

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15376&source=1111&tags=domestic+campus+2025_1111

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