職缺描述
1.負責半導體IC設計、先進封裝技術、CMP製程整合、品質管理 Responsible for semiconductor IC design, advanced packaging, CMP integration, and quality management. 2.產品領域為消費性電子等 Focus on consumer electronics products. 3.工作地點為台北/新竹/台中 The job is based in Taipei, Hsinchu or Taichung.
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